50% of fees
Fee waiver/discount
Expected August 2027
بكالوريوس, دراسات عليا
Bond University
غير محدد
Provides 50% tuition remission for any undergraduate degree including approved combined programs up to 320 credit points (excluding the Bond Medical Program), or postgraduate degree (excluding research degrees).
All International
تنطبق على جميع الأجناس
كافة أشكال طرق التسليم
جميع الطلاب المؤهلين
دوام كامل
All intakes
Mature students
To be eligible to apply for this scholarship, you must:
What are the obligations of this scholarship?
يجب التقدم بطلب منفصل لهذه المنحة الدراسية
If you meet the eligibility criteria for this scholarship, we encourage you to apply by following the below steps:
You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered
Expected August 2027