Microelectronics Packaging Certificate

University of Arizona

Incorporating a curriculum that bridges Materials Science and Engineering and Electrical and Computer Engineering, the Certificate in Microelectronic Packaging offers a streamlined educational experience for established professionals while providing a distinguishing credential for degree-seeking students interested in focusing their career path. Courses address critical materials concepts, packaging principles, and fabrication methodologies central to development of interconnection and environmental isolation systems for microelectronic devices. Paired with exposure to advanced characterization methods and equipment, the certificate offers participants a state-of-the-art experience on a path to enhanced opportunity in the microelectronics industry.