College of Engineering Undergraduate Certificate in Microelectronic fabrication دراسة University of Idaho في

Undergraduate Certificate in Microelectronic fabrication

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This certificate offered on the Moscow campus provides students with a strong foundation in semiconductor device fabrication and cleanroom practices. Through a combination of core and elective coursework, you’ll gain hands-on experience in photolithography, thin film deposition and interconnect technologies. The program emphasizes problem-solving, experimentation, data analysis and effective communication - skills essential for success in the microelectronics industry. As a graduate of this certificate program, you’ll be well-prepared to pursue careers or further education in microelectronics, nanotechnology and related engineering fields.

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College of Engineering

خيارات الدراسة

دوام كامل (2 فصول دراسية)

رسوم التسجيــل
US$29,300.00 سنوياً
Books and supplies – USD $1,260
الموعد النهائي للتسجيل

01/10/2026

تاريخ البدء

يناير 2027

مكان عقــد الدورة

Moscow (Main Campus)

875 Perimeter Drive MS 4264,

Moscow,

Idaho,

83844, West, United States

دوام كامل (2 فصول دراسية)

رسوم التسجيــل
US$29,300.00 سنوياً
Books and supplies – USD $1,260
الموعد النهائي للتسجيل

01/03/2027

تاريخ البدء

مايو 2027

مكان عقــد الدورة

Moscow (Main Campus)

875 Perimeter Drive MS 4264,

Moscow,

Idaho,

83844, West, United States

شروط القبول

للطلاب الدوليين

A 2.5 grade-point average (GPA) on a 4.0 scale is required from your secondary school. You must also meet criteria for admission to university-level study in your home country. The Admissions Office will convert grades/marks to a 4.0 U.S. scale.Credentials eligible for transfer credit:International Baccalaureate (IB)General Certificate of Education – Advanced Level (GCE-A Level)Global Assessment Certificate (GAC)Advanced Placement (AP) and College-Level Examination Program (CLEP)

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